In this episode of TTM Technologies' Tech-Express, we will delve into the past, present, and future of RF and Specialty Components (RF&S) for inspiration in the development of new generations of products...
͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏
| In this episode of TTM Technologies' Tech-Express, we will delve into the past, present, and future of RF and Specialty Components (RF&S) for inspiration in the development of new generations of products. We will take a look at Doherty Combiners from the past that remind us of the integration demands of future power amplifiers, where efficiency and form factor will be the pillars of success. Additionally, we will explore Ultra-Broadband Crossovers that are positioned to support layer count reduction and higher levels of integration while meeting the downward cost trends of the system. Lastly, we will showcase our emerging ETS technology that challenges conventional thermal management approaches with innovation and cleverness to limit cost and increase flexibility in the pursuit of thermal management. In addition, we will introduce our new product release section on ttm.com which offers customers unprecedented access to new RF&S product developments and allows for early sampling and evaluation.
Here's to a great 2024 and more excitement in our industry! – Mark Bowyer
|
|
|
| |
|
|
| 6.0mm x 3.1mm Sub-1GHz integrated inverted Doherty combiners |
|
|
| |
|
|
| With system densities continuing to demand smaller form factors and leveraging the class leading Xinger® design and manufacturing capability, TTM has created a family of inverted Doherty combiners in 6.0mm x 3.18mm packages, handling 20 Watt AVG power levels with a peak to average of 12dB. The purpose of these highly compact sub 1GHz Doherty combiners is to offer small form factors in achieving high efficiency combiners for high and low output power levels. The Xinger® Doherty’s allows the power amplifier to maintain high efficiency even at lower output power levels, making this approach to compact inverted Doherty combiner ideal for amplifiers that need to operate efficiently at varying output power levels in the smallest possible footprint, such as in wireless communication systems. |
|
|
| |
|
|
| To access the datasheets for Doherty combiners, simply click on the button below. |
|
|
| |
|
|
| Exploring Engineered Thermal Solutions |
|
Engineered Thermal Solutions (ETS) is a unique plating process to create solid copper features for heat transfer through or across a Printed Circuit Board (PCB) utilizing standard PCB manufacturing equipment. ETS has been optimized to maximize heat transfer through thin PCBs with excellent flatness and electrical ground connectivity. It was developed to combine the individual benefits of existing PCB heat transfer solutions Coins. Thermal Via’s, without the common drawbacks of these traditional approaches and the added bonus of nontraditional shapes and can create “T” shapes for greater heat dissipation. Click the button below to read our short but informative white paper on ETS.
|
|
|
| |
|
|
| New Ultra Broadband RF-RF Crossovers in tiny 0603 (1.69mm x 0.94mm) package |
|
|
| |
|
|
| The X00140L5050AHF (DC-14GHz) and XMX00180L1G (DC-18GHz) are low cost, low profile sub-miniature (0603) RF to RF crossover that enables the transition of two intersecting RF traces in an easy to use Xinger® style manufacturing friendly surface mount package. Each cross over has a power rating of 2 Watts (AVG) and a peak to average ratio of 12dB. It is designed particularly for ultra-wide band and high frequency applications in all end markets including telecom and COTS Mil-Aero. The crossover is ideal for any critical applications where layout and available space are at a premium and resorting to addition PWB layers and larger overall footprints are cost prohibitive. |
|
|
| |
|
|
| Read more to access datasheets and samples for these RF&S crossovers. |
|
|
| |
|
|
| Stay Ahead of the Curve with Exclusive Access to Upcoming Product Developments |
|
|
| |
|
|
| The “RF & Specialty Components New Products” page is a new section on ttm.com provided to give customers an exclusive sneak peek into the future of our talented engineering team’s latest product developments. This section aims to provide our customers with early access to new parts for evaluation while parts are prepared for high-volume production.
We aim to minimize the time it takes to access new product developments, empowering our customers to experiment and verify product performance in their applications. We understand the importance of providing you with the latest technology and products; this new feature will help you achieve that goal.
We will add new parts to this section monthly, which will be transferred to our product pages when availability in our distribution channel has been established. We hope this feature will help you stay ahead of the game and give you a competitive edge in your industry.
Click the button below to see all the new parts in this section and request samples for evaluation. |
|
|
| |
|
|
| New 0805 (1.27mm x 2.03mm) DC-13GHz 50 Ohm termination resistor |
|
|
| |
|
|
| The C6N50Z4B is a high-performance Aluminum Nitride (AlN) surface mount termination intended as a cost-competitive alternative to Beryllium Oxide (BeO). The termination has a power handling of 6 Watts AVG and a peak to average of 12dB and is well suited to all end markets. The high power handling makes the part ideal for terminating high-power Xinger® 90-degree and directional couplers and for use in microstrip circuits. The termination is also RoHS compliant! |
|
|
| |
|
|
| Click the button below to see more about this high performer and request samples for evaluation. |
|
|
| |
|
|
| Looking for something more? Talk to our RF&S Specialist directly |
|
|
| |
|
|
| TechExpress powered by TTM Technologies You received this email because you signed up on our website or made a purchase from us
|
|
|
| |
|
|
