Printed Circuit Boards (“PCB”s) are the unsung heroes of modern electronics, forming the intricate backbone upon which all advanced technology relies...
Printed Circuit Boards (“PCB”s)are the unsung heroes of modern electronics, forming the intricate backbone upon which all advanced technology relies. From medical devices to critical industrial systems, the performance, reliability, and cost-effectiveness of any electronic device are inextricably linked to the quality and manufacturability of its PCB. Designing these complex multi-layered structures requires a deep understanding of material science, electrical engineering, and manufacturing processes to ensure that theoretical designs translate seamlessly into physical, high-performing products. The precision required in every trace, via, and layer stack-up is paramount, making Design for Manufacturability (“DFM”) not just a best practice, but a fundamental necessity for successful product development.
To help engineers navigate the complexities of DFM, TTM Technologies is excited to announce our upcoming webinar, “How to Apply DFM Rules to Different Stack-up Constructions”. Attendees will gain a better understanding of fabrication minimum design guidelines and how to apply them to their future designs. Register below or visit our website at www.ttm.com for a wealth of other learning resources.
Yours sincerely,
TTM Corporate Marketing
Monthly Highlights
TTM Technologies continues to innovate in the field of Radio Frequency ("RF" ) & Specialty components with the introduction of new ultra small RF crossover and splitter components.
TTM Technologies continues to innovate in the field of Radio Frequency & Specialty components with the introduction of new ultra small RF crossover and splitter components. Read the full announcement here:
Thank You for Joining Us at Electronica India 2025!
We had an incredible three days at Electronica India 2025! Thank you to everyone who visited our booth. We truly enjoyed connecting with you, sharing our latest technologies, and exchanging innovative ideas.
Want to relive the best moments? Check out our highlights from the event!
TTM Technologies recently held our 2025 Supplier Day Summit, with the theme "Sustainable Growth through Partnership.” This cross-continental event brought together 180 representatives from over 80 suppliers in Asia Pacific and North America, fostering valuable relationships through insightful keynotes, engaging panel discussions, and interactive sessions to improve customer satisfaction. We are dedicated to working closely with our suppliers as we create innovative solutions that lead the industry.
Events
AUSA
Join us at the upcoming AUSA Annual Meeting in Washington, D.C., October 13 –15, at booth #7721. We are pushing the boundaries of technology with cutting-edge solutions in communication, radar, and surveillance. Stop by to meet with our experts or schedule a meeting by clicking here!
We're excited to announce our participation at RADECS 2025 in Antwerp, Belgium, from September 29 - October 3. Visit us at booths 22 & 23 to discover how we're shaping the future of Microelectronics!
Webinar
How to Apply DFM Rules to Different Stack-up Constructions
This webinar will step through multiple stack-ups – created for different requirements and/or increasing complexity – and highlight trade-off considerations for each. Then, individual elements of the design guidelines will be applied to each stack-up and layer type (plated or etched-only) to determine the design requirements, such as: max aspect ratio and min drill/pad diameters, lines/spaces, drill-to-copper clearances, and embedded feature-to-plane clearances, etc. Attendees will gain a better understanding of fabrication minimum design guidelines and how to apply them to their future designs.
North America: Sept 30, 2025 | 10:00 am (PDT) | 1:00 pm (EDT) Europe & India: Oct 13, 2025 | 2:00 pm (BST) | 3:00 pm (CEST) | 4:00 pm (EEST) | 6:30 pm (IST)
The artificial intelligence boom is driving sharp demand growth across the PCB materials chain, pushing both prices and volumes higher. Supply pressure is no longer limited to low-CTE fiberglass fabrics used in CoWoS substrates; shortages are now spreading to low-Dk fiberglass fabrics for CCL, HVLP copper foil, and coated microdrills required for PCB drilling.
Total North American PCB shipments in July 2025were up 20.7% compared to the same month last year. Compared to the preceding month, July shipments were up 11.3%. July's YTD shipments increased by 7.6% YOY.
South America is arriving late to the electric vehicle transition, but the pace of change is beginning to quicken. For most of the 2010s, the region was a marginal player, with electric cars counted in the hundreds while China and Europe were racing ahead in the millions. That has shifted in the past two years. By 2024, several South American markets had already crossed the 5% threshold for electric vehicle sales, a point that has historically signaled the start of rapid adoption.
Germany's once-dominant automotive sector is facing its most profound reckoning in decades, shedding over 52,000 jobs — a 6.7% decline — in the past year alone, according to the market intelligence.
Across the medtech landscape, the race is on among dozens of companies looking to secure a place in the high-growth business of surgical robotics. New developers that have been working for years to bring their efforts to market are now ready to launch platforms in the U.S. — or are close to it.
With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely seen as the next-generation interconnect. The technology is quickly transitioning from the lab to mass production, laying the groundwork for future advances in memory and HBM.
South Korean experts are raising alarms that domestic semiconductor equipment manufacturers may be falling behind in developing hybrid bonding technology—critical for advancing next-generation HBM chips.
Looking ahead to 2026, most consumer product shipments are expected to remain flat or grow only modestly by around 1%, while wearables and automobiles may decline. Even AI servers are expected to see slower growth after two years of rapid expansion and a high base effect.
The boom in AI infrastructure drove a substantial upward revision of the forecast: $123bn in GPUs and AI accelerators shipped in 2024, $207bn is expected in 2025, and $286bn by 2030.
Following two years of steep declines, initial estimates show that total RAN revenues—including baseband, radio hardware, and software, excluding services—advanced for a third consecutive quarter outside of China in 2Q 2025.
Contact Us
If you have a tech idea, need a quote, or require technical support,
You have received this email because you have opted in to receive Digest newsletter from TTM Technologies. If you feel this message was delivered to you in error, or that you may have been included in an unsolicited mailing, please report this incident immediately to [email protected].
If you want to know more details about the TTM Technologies Privacy Policy, please click here.
Follow us on:
Unsubscribe:
We respect your privacy and your preferences for communications with TTM Technologies. If you prefer not to receive Digest newsletter from us, please click the link below to unsubscribe.
